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SURFACE MOUNT ASSEMBLY 
Micro BGA
Capabilities
Vision Placement 
Computer Controlled Reflow 
High Speed Surface Mount  Placement
Automated Optical Inspection 
Data Transfer Via Internet
Today's products demand that circuit boards provide broad capabilities in very restricted space. Siemens' surface mount technology allows you to obtain these higher densities at a competitive price.
Nearly all of the components used in Siemens' surface mount process are machine placed. We use precision silk screening and fully automated, vision assisted, high speed robotics, along with the latest in reflow soldering to assure that your product is manufactured cost effectively using the latest packaging techniques. Our seven fully-automated lines enable us to place nearly 1 million surface mount components in an eight hour shift.
AdVantisX Lightening  (30,000 pph)
As Part of our commitment to remain ahead of technological trends, Siemens was the first contract manufacturer in the St. Louis area to install surface mount capabilities nearly two decades ago. This commitment is continued with the installation of automated vision inspection equipment, another St. Louis first. We look forward to helping you leverage the advantages of increased automation and denser packaging in your products.
Equipment 
Universal
AdVantisX AC-30s
(3 ea.)
Universal
AdVantisX Ax-7s
(3 ea.)
Fuji CP-IV
chip shooters
(5 ea.)
Fuji IP-III
(5 ea.)

Heller 1800
reflow oven
(8 ea.)
Some scenes from our 8 surface mount lines

Copyright © 1997 Siemens Manufacturing Co.,Inc.
Last modified: 07/16/2011